In 2.1D packaging, the organic bridge is cut from resin or polymer and connects dies while serving as insulation, offering potential cost reductions and easier mass production compared to traditional 2.5D packaging that relies on silicon, glass, or ceramic interposers.

This technology is positioned to benefit AI data centers by enabling cheaper, scalable fabrication of AI processors.

Development activity on this approach appears to have begun around late 2024, with a patent filed for the interconnected bridge technology.

Samsung and Qualcomm are partnering on a new AI semiconductor packaging approach that uses organic materials to connect multiple microcircuit dies.

2.1D packaging aims to deliver higher bandwidth and lower production costs, while addressing supply chain concerns tied to silicon-based interposers.